Specifications:

Layers: 1 to 48

Board finished thickness: 0.21 to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers

Maximum finished board size: 23 x 25mm (580 x 900mm)

Minimum drilled hole size: 3 mils (0.075mm)

Minimum line width: 3 mils (0.075mm)

Minimum line spacing: 3 mils (0.075mm)

Size: 243.4 x 244.43mm

Surface finishing/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold,

immersion silver/gold, OSP, gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask colors: green, yellow, black, white, red, blue

Copper thickness in hole: >25.0µm (>1 mil)

Packing:

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

Shape tolerance: ±0.13

Hole tolerance:

PTH: ±0.076

NPTH: ±0.05

With UL, SGS and RoHS marks

Special requirements: buried and blind via + controlledimpedance + BGA

Profiling: punching, routing, V-cut, beveling

Testing procedure:

Visual inspection

Flying probe

Impedance control

Solder-ability detection

Digital metallographic microscope

AOI (automated optical inspection)

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Services:

No MOQ

Provide OEM services

Multilayer PCB sample: 6-10 days, mass production: within 15 days

Double-sided PCB sample: 3-5 days, mass production: within10 days

Shipping methods: DHL, UPS, FedEx, TNT forwarder